Diamond wafering saws ranging from low speed precision cutters to high speed automatic diamond wafer cutters. These diamond and small abrasive saws have low and high speed cutting capabilities for a wide range of materials from ceramics and glass to sensistive electronics components.

For mounting, the these mounting presses can produce mounts ranging from 1" to 2" diameter. These presses are available in a semi-automated (manual pressure adjustment with auto heating / cooling), an automated version (automated pressure and heating / cooling) and a fully automatic prgrammable versin for 200 operator-created programs.

These fixed or variable speed manual polishing machines are available in wheel sizes ranging from 8" - 12" diameter.

For polishing automation, individual specimens (FEMTO 1000) or individual / central specimen holder (DIGIPREP and FEMTO 2000) power polishing heads are available.