Material-Specific Preparation Guide

Comprehensive guide covering preparation techniques for various material types including grinding, polishing, and etching recommendations.

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Get a printable guide with material-specific preparation procedures for common metals and alloys.

Grinding: Start with 120-240 grit SiC, progress through 320, 400, 600, 800, 1200

Polishing: 9μm → 6μm → 3μm → 1μm diamond, final with 0.05μm colloidal silica

Etching: 2-5% Nital or Picral, depending on structure to reveal

Notes: Standard preparation sequence, adjust grits based on hardness

Grinding: Start with 240-320 grit, progress through 400, 600, 800, 1200

Polishing: 9μm → 3μm → 1μm diamond, final with 0.05μm colloidal silica

Etching: Vilella's Reagent, Adler's, or Kallings No. 2 depending on grade

Notes: Work-hardening material, use consistent moderate pressure

Grinding: Start with 240-320 grit (softer), progress through finer grits

Polishing: 6μm → 3μm → 1μm diamond, final with 0.05μm colloidal silica

Etching: Keller's Reagent or Al-NaOH etchant

Notes: Soft material, use shorter times and lighter pressure to avoid smearing

Check out our comprehensive material-specific guides for detailed procedures.